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Hong Kong Launches RMB 1.5 Billion Infrastructure Bond Tender
Hong Kong Launches RMB 1.5 Billion Infrastructure Bond Tender
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The Hong Kong Monetary Authority (HKMA) is set to auction RMB 1.5 billion in 2-year government bonds on May 13, 2025, as part of its Infrastructure Bond Programme. The securities, maturing in May 2027, carry a 1.71% annual coupon with semi-annual payments.
Primary Dealers will exclusively participate in the tender, underscoring institutional demand for RMB-denominated debt instruments. The move reinforces Hong Kong’s role as a gateway for mainland China’s capital markets amid growing global interest in Asian fixed income.
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